Title :
Nondestructive method of TIM bondline measurement in Flip Chips package
Author :
Heng, H.C. ; Ben, V.S. ; Keok, K.H. ; Jay, Rajiv
Author_Institution :
Adv. Micro Devices Export, Bayan Lepas, Malaysia
Abstract :
This paper describes the method of using Acoustic Micro Imaging (AMI) technique as nondestructive method to measure the bond line thickness (BLT) of the thermal interface material (TIM) in Flip Chips package; this is an alternative to destructive physical analysis. The purpose of this study is to demonstrate the capability of AMI used to measure the BLT of TIM. The two interfaces of interest are Lid-to-TIM. and TIM-to-Silicon chip. AMI is a nondestructive inspection technique that utilizes high frequency ultrasound in the range of 5 to 500 MHz to: -determine interface bonding/adhesion detect -defects -characterize & measure material properties Acoustic Micro Imaging instrument shown here is an effective technique for nondestructively evaluating the TIM thickness. The images in this report demonstrate a few of many imaging and analysis techniques within AMI technology that are useful for production screening and in laboratory. These capabilities make it an excellent choice for a fast, reliable and accurate to measure the thermal interface material after joining the lid with the backside of the flip chip without manual cross section.
Keywords :
chip scale packaging; flip-chip devices; inspection; nondestructive testing; ultrasonic imaging; TIM bondline measurement; acoustic microimaging instrument; acoustic microimaging technique method; bond line thickness; destructive physical analysis; flip chip package; frequency 5 MHz to 500 MHz; interface bonding; material properties; nondestructive inspection technique; thermal interface material; Acoustic imaging; Acoustic measurements; Ambient intelligence; Bonding; Flip chip; Image analysis; Packaging; Semiconductor device measurement; Thickness measurement; Ultrasonic imaging;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location :
Penang
Print_ISBN :
978-1-4244-3392-6
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2008.5507830