A dual-mode built-in self-test technique for capacitive MEMS devices

A built-in self-test (BIST) scheme which partitions the fixed (instead of movable) capacitance plates of a capacitive MEMS device is proposed. The BIST technique divides the fixed capacitance plate(s) at each side of the movable microstructure into three portions: one for electrostatic activation and the other two equal portions for capacitance sensing. Due to such partitioning, the BIST technique can be applied to surface-, bulk-micromachined MEMS devices and other technologies. Further, sensitivity and symmetry BIST methods based on this partitioning are also introduced. The combination of both BIST modes covers a larger defect set, thus a robust testing for the device can be expected. The BIST technique is verified by three typical capacitive MEMS devices. Simulation results show that the proposed technique is an effective BIST solution for various capacitive MEMS devices.