• DocumentCode
    2994114
  • Title

    Important qualification process to wafer probing

  • Author

    Yoon-Peng Yee

  • Author_Institution
    Nat. Semicond. Sdn. Bhd., Batu Berendam, Malaysia
  • fYear
    2008
  • fDate
    4-6 Nov. 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Wafer fabrication technology has overcome many challenges and achieved small pitch at high current density nowadays, hence durable and sustainable probing tools are essential. Since good qualification process determines good tools to use, the scope of study in probe card fabrication has to be comprehensive enough to cover all that needed to be covered in forming an effective wafer probing characteristics. National Semiconductor has conducted a series of experiments looking into probing characteristics over a period of time. From the experimental results, conclusions were reached to setup guidelines to be applied to probe card fabrication with correct probe pressure.
  • Keywords
    probes; wafer level packaging; National Semiconductor; durable probing tools; probe card fabrication; probe pressure; qualification process; sustainable probing tools; wafer fabrication technology; wafer probing; Assembly; Circuits; Fabrication; Metallization; Nonhomogeneous media; Probes; Qualifications; Testing; Tiles; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
  • Conference_Location
    Penang
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-3392-6
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2008.5507868
  • Filename
    5507868