DocumentCode
2994114
Title
Important qualification process to wafer probing
Author
Yoon-Peng Yee
Author_Institution
Nat. Semicond. Sdn. Bhd., Batu Berendam, Malaysia
fYear
2008
fDate
4-6 Nov. 2008
Firstpage
1
Lastpage
5
Abstract
Wafer fabrication technology has overcome many challenges and achieved small pitch at high current density nowadays, hence durable and sustainable probing tools are essential. Since good qualification process determines good tools to use, the scope of study in probe card fabrication has to be comprehensive enough to cover all that needed to be covered in forming an effective wafer probing characteristics. National Semiconductor has conducted a series of experiments looking into probing characteristics over a period of time. From the experimental results, conclusions were reached to setup guidelines to be applied to probe card fabrication with correct probe pressure.
Keywords
probes; wafer level packaging; National Semiconductor; durable probing tools; probe card fabrication; probe pressure; qualification process; sustainable probing tools; wafer fabrication technology; wafer probing; Assembly; Circuits; Fabrication; Metallization; Nonhomogeneous media; Probes; Qualifications; Testing; Tiles; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location
Penang
ISSN
1089-8190
Print_ISBN
978-1-4244-3392-6
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2008.5507868
Filename
5507868
Link To Document