• DocumentCode
    2994375
  • Title

    An efficient analytical model of coupled on-chip RLC interconnects

  • Author

    Yin, Liang ; He, Lei

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    385
  • Lastpage
    390
  • Abstract
    In this paper, we present a new decoupled model for two coupled transmission lines with consideration of the inductive effect. It maps two coupled lines into two completely isolated lines with separated drivers and receivers, and has no loss of accuracy during the decoupling procedure. Further, we derive a closed-form time domain response for an isolated transmission line using a one-segment RLC Π model. Combining the two models, we have an analytical time-domain solution to two coupled transmission lines. The model gives satisfied results for up to 5000 μm long lines when compared to SPICE simulation over an accurate distributed RLC circuit model, and can be used to model on-chip wires in the layout design, logic synthesis and high level design
  • Keywords
    coupled transmission lines; distributed parameter networks; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; matrix algebra; time-domain analysis; transmission line theory; analytical model; closed-form time domain response; coupled on-chip RLC interconnects; coupled transmission lines; decoupled model; high level design; inductive effect; isolated transmission line; layout design; logic synthesis; onchip wires; one-segment RLC Π model; Analytical models; Circuit simulation; Coupled mode analysis; Coupling circuits; Distributed parameter circuits; Integrated circuit interconnections; RLC circuits; SPICE; Time domain analysis; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2001. Proceedings of the ASP-DAC 2001. Asia and South Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    0-7803-6633-6
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2001.913337
  • Filename
    913337