• DocumentCode
    2994686
  • Title

    Half cut stress concentration (HCSC) region design on MEMS piezoresistive cantilever for sensitivity enhancement

  • Author

    Firdaus, S.M. ; Azid, I.A. ; Sidek, Othman ; Ibrahim, Khalil ; Magdy Hussien

  • Author_Institution
    Sch. of Mech. Eng., Univ. Sains Malaysia, Nibong Tebal, Malaysia
  • fYear
    2008
  • fDate
    4-6 Nov. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This work introduced a half cut stress concentration (HCSC) region on the surface of MEMS piezoresistive cantilever in order to improve the sensitivity of a cantilever sensor based on loading/force effect. From the available information, by increasing the stress occurred on the cantilever surface where piezoresistive region place the sensitivity will increase greatly. The designs were simulated using ANSYS 9.0 in order to study the stress distribution and displacement effect. Results obtain for solid cantilever and designed cantilever have been compared. As expected, stress that occurred was increased and highly concentrated at the HCSC region. The cantilever sensitivity also enhances by 4 times. This design of cantilever can obviously improve the sensitivity of the surface stress cantilever.
  • Keywords
    cantilevers; micromechanical devices; microsensors; piezoresistive devices; sensitivity analysis; stress effects; ANSYS 9.0; MEMS piezoresistive cantilever; cantilever sensitivity enhancement; cantilever sensor; displacement effect; half cut stress concentration region design; loading-force effect; stress distribution; surface stress cantilever; Circuit faults; Fault diagnosis; Field programmable gate arrays; Logic testing; Manufacturing; Micromechanical devices; Piezoresistance; Stress; Table lookup; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
  • Conference_Location
    Penang
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-3392-6
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2008.5507894
  • Filename
    5507894