DocumentCode
2994824
Title
Toward better wireload models in the presence of obstacles
Author
Cheng, Chung-Kuan ; Kahng, Andrew B. ; Liu, Bao ; Stroobandt, Dirk
Author_Institution
Dept. of Comput. Sci. & Eng., California Univ., San Diego, La Jolla, CA, USA
fYear
2001
fDate
2001
Firstpage
527
Lastpage
532
Abstract
Efficient and accurate interconnect estimation is crucial to design convergence. With System-on-Chip design, IP blocks form routing obstacles that cannot be accounted for by existing a priori wirelength estimations. In this paper, we identify two distinct effects of obstacles on interconnection length: (i) changes due to the redistribution of interconnect terminals and (ii) detours that have to be made around the obstacles. Theoretical expressions of both effects for point-to-point nets with a single obstacle are derived and compared to experimental observations. We also experimentally assess these effects for multi-terminal interconnections and in the presence of multiple obstacles. We single out cases where the effects are additive, which suggests the use of lookup tables and equivalent blockage relations. Our results are applicable in chip planning tools, where they enable improved accounting for obstacles in a priori wirelength estimation schemes
Keywords
integrated circuit design; integrated circuit interconnections; integrated circuit modelling; multiterminal networks; IP block; a priori wirelength estimation; chip planning tool; deep submicron IC design; detour; equivalent blockage relation; interconnect terminal redistribution; interconnection length; lookup table; multi-terminal interconnection; obstacle; point-to-point net; system-on-a-chip; wireload model; Convergence; Delay estimation; Electronic design automation and methodology; Parameter estimation; Path planning; Routing; System-on-a-chip; Table lookup; Wire; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2001. Proceedings of the ASP-DAC 2001. Asia and South Pacific
Conference_Location
Yokohama
Print_ISBN
0-7803-6633-6
Type
conf
DOI
10.1109/ASPDAC.2001.913362
Filename
913362
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