Title : 
Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites
         
        
            Author : 
Tagami, N. ; Okada, M. ; Hirai, N. ; Tanaka, T. ; Ohki, Y. ; Imai, T. ; Harada, M. ; Ochi, M.
         
        
            Author_Institution : 
Waseda Univ., Shinjuku
         
        
        
        
        
        
            Abstract : 
Effects of the differences in the curing agent and filler dispersion method on the dielectric properties were examined for epoxy/clay nanocomposites. Measurements of permittivity, conductivity, and space charge distribution suggest that the curing agent gives a strong effect and the presence of nanofillers affects secondly, while the filler dispersion method gives a weak effect.
         
        
            Keywords : 
clay; curing; electrical conductivity; filled polymers; nanocomposites; permittivity; space charge; conductivity; curing; dielectric properties; epoxy nanocomposites; filler dispersion methods; nanofillers; permittivity; space charge distribution; Charge measurement; Conductivity measurement; Curing; Current measurement; Dielectric materials; Dispersion; Electric variables measurement; Epoxy resins; Nanocomposites; Permittivity measurement;
         
        
        
        
            Conference_Titel : 
Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
         
        
            Conference_Location : 
Vancouver, BC
         
        
            Print_ISBN : 
978-1-4244-1482-6
         
        
            Electronic_ISBN : 
978-1-4244-1482-6
         
        
        
            DOI : 
10.1109/CEIDP.2007.4451465