Computer-aided design of mixed-technology VLSI systems

Author

Kang, Sung-Mo ; Chen, Jinghong

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

fYear

2000

fDate

2000

Firstpage

4

Lastpage

7

Abstract

In this paper, we present specific CAD issues along with new point tools for design for reliability and manufacturability of mixed-technology VLSI systems. Reliability concerns have been rising for hot carrier induced degradation, oxide breakdown, electromigration, electrostatic discharge, and electrical overstress. In particular, we discuss electrothermal analysis of VLSI systems with emphasis on temperature-aware placement of modules and static timing analysis. Composite simulation of MEMS and MOEMS are also discussed

Keywords

VLSI; circuit CAD; circuit layout CAD; circuit simulation; design for manufacture; integrated circuit design; integrated circuit reliability; micro-optics; micromechanical devices; monolithic integrated circuits; thermal analysis; timing; CAD tools; EOS; ESD; MEMS; MOEMS; composite simulation; computer-aided design; design for manufacturability; design for reliability; electrical overstress; electromigration; electrostatic discharge; electrothermal analysis; hot carrier induced degradation; mixed-technology VLSI systems; oxide breakdown; static timing analysis; temperature-aware module placement; Computer aided manufacturing; Degradation; Design automation; Electric breakdown; Electromigration; Electrostatic discharge; Electrothermal effects; Hot carriers; Pulp manufacturing; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2000. IEEE APCCAS 2000. The 2000 IEEE Asia-Pacific Conference on

Conference_Location

Tianjin

Print_ISBN

0-7803-6253-5

Type

conf

DOI

10.1109/APCCAS.2000.913390

Filename

913390