DocumentCode
2995549
Title
Dielectric characterization of a nanostructured polymer microcomposite and its constituents
Author
Javan, M. ; Fréchette, M.F. ; Lessard, M. ; Bartnikas, R. ; Cole, K. ; Desgagnés, D.
Author_Institution
lnst. de recherche d´´Hydro-Quebec, Varennes
fYear
2007
fDate
14-17 Oct. 2007
Firstpage
252
Lastpage
255
Abstract
The frequency and temperature dependence of permittivity and dielectric loss is examined between 0.01 Hz and 1.0 MHz in the range from -50degC to 130degC of a nanostructured composite in an epoxy matrix and compared with that of its constituents (60% quartz and 0.45 % nanoclay by weight). For quartz, which is in powdered form, the variation of permittivity is found to be almost linear with frequency while for nanoclay it exhibits a pronounced increase with decreasing frequency and increasing temperature. In epoxy, the dissipation factor peak magnitude at 10 kHz and 40degC decreases as it shifts to lower frequencies with falling temperature as opposed to that of quartz for which the dielectric losses rise with increasing temperature as the frequency is reduced. When the behavior of the entire nanostructured polymer microcomposite is examined, it is found to exhibit dielectric loss frequency response characteristics similar to that of the microcomposite epoxy-quartz compound without nanoclays, with a marked decrease of dielectric loss with decreasing frequency. Evidently, even a miniscule amount of the incorporated nanoclay (0.45 % by weight) exerts a pronounced effect upon the behavior of the microcomposite. The possibility of a number of dielectric loss mechanisms are considered to account for the observed behavior.
Keywords
clay; dielectric losses; filled polymers; frequency response; nanocomposites; permittivity; powders; quartz; dielectric loss frequency response; dissipation factor; epoxy matrix; microcomposite epoxy-quartz compound; nanoclay; nanostructured polymer microcomposite; permittivity; powdered form; Dielectric losses; Frequency response; Permittivity; Plastic insulation; Polymers; Silicon compounds; Surface resistance; Temperature; Transmission electron microscopy; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
Conference_Location
Vancouver, BC
Print_ISBN
978-1-4244-1482-6
Electronic_ISBN
978-1-4244-1482-6
Type
conf
DOI
10.1109/CEIDP.2007.4451490
Filename
4451490
Link To Document