• DocumentCode
    2996093
  • Title

    Influence of ambient temperature on the failure behavior of cable joints

  • Author

    Jongen, R.A. ; Morshuis, P.H.F. ; Smit, J.J. ; Janssen, A.L.J.

  • Author_Institution
    Delft Univ. of Technol., Delft
  • fYear
    2007
  • fDate
    14-17 Oct. 2007
  • Firstpage
    643
  • Lastpage
    646
  • Abstract
    The failure behavior of resin cable joints in the medium voltage underground network in the Netherlands shows a correlation with the ambient temperature of the air above the ground. This behavior is especially seen when the failures occurred during the summer months are considered. In the last years the months July or August were very hot and the number of failures increased significantly in these months. The ambient temperature has an influence on the soil temperature through the year even 0.5 -1 meter below surface level where most cables are installed. It can also be seen that the failures follow the rise and fall of the average air temperature during the different days of the month with increasing and decreasing number of failures with some time delay. The change of the soil temperature around the joint results in a higher temperature within the joint, thus contributing to the failure of a joint, which is already in its ageing stage. The presence of a hotspot in combination with a rise of the soil temperature can result into breakdown. In this paper the failure behavior of resin cable joints and the possible effect of ambient temperature are discussed.
  • Keywords
    ageing; cable jointing; failure analysis; underground cables; Netherlands; ageing stage; air temperature; ambient temperature; failure behavior; medium voltage underground network; resin cable joints; soil temperature; Electric breakdown; Heat transfer; Land surface temperature; Power cable insulation; Power cables; Resins; Soil; Temperature dependence; Temperature distribution; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    978-1-4244-1482-6
  • Electronic_ISBN
    978-1-4244-1482-6
  • Type

    conf

  • DOI
    10.1109/CEIDP.2007.4451520
  • Filename
    4451520