• DocumentCode
    2996500
  • Title

    Characterization of nanofilled epoxy varnish subjected to surface partial discharges

  • Author

    Guastavino, F. ; Balbo, M. ; Coletti, G. ; Zunino, F. ; Oldrati, A.

  • Author_Institution
    Univ. of Genova, Genova
  • fYear
    2007
  • fDate
    14-17 Oct. 2007
  • Firstpage
    267
  • Lastpage
    270
  • Abstract
    An epoxy matrix varnish, used for topping treatment of electrical machines stators, was studied. The experimental nanocomposites were prepared using the same organically modified clay varying the mixing process. The nanostructure of each material was assessed by means of WAXRD. The homogeneity at the micron level was checked via SEM observations of brittle fractured sections. DSC analyses were conducted on both pure and nanofilled samples. Surface partial discharges resistance of both the nanocomposite varnishes and the traditional microcomposite, with the same epoxy matrix, was compared. Damages due to partial discharges were observed through optical microscopy and SEM, while an estimate of the surface erosion was obtained through roughness measurements.
  • Keywords
    X-ray diffraction; brittle fracture; clay; differential scanning calorimetry; filled polymers; nanocomposites; nanostructured materials; optical microscopy; scanning electron microscopy; surface discharges; surface roughness; DSC; SEM; WAXRD; brittle fractured sections; electrical machines stators; homogeneity; nanocomposites; nanofilled epoxy varnish; nanostructure; optical microscopy; organically modified clay; roughness measurements; surface erosion; surface partial discharges resistance; topping treatment; Nanocomposites; Nanostructured materials; Optical microscopy; Partial discharges; Rough surfaces; Scanning electron microscopy; Surface cracks; Surface discharges; Surface resistance; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    978-1-4244-1482-6
  • Electronic_ISBN
    978-1-4244-1482-6
  • Type

    conf

  • DOI
    10.1109/CEIDP.2007.4451546
  • Filename
    4451546