DocumentCode
2996643
Title
Platform stitching capacitors impact to high-speed differential links on non-ideal return path
Author
Lun, Ching Kai ; Guan, Yew Teong ; Kheong, Yoon Chee ; Lee, Fabian Kung Wai ; Yong, Wong Hin ; Vetharatnam, Gobi
Author_Institution
PDC (PG2), Intel Microelectron., Bayan Lepas, Malaysia
fYear
2009
fDate
15-16 July 2009
Firstpage
216
Lastpage
220
Abstract
This paper discusses the validity of platform stitching capacitors in facilitating high-speed differential links signal return path on non-ideal reference plane. A platform design guideline for the stitching capacitor is recommended at the end of this study. The results from this study were used to enable a huge reduction in the number of platform stitching capacitors, which scored major design wins to both Intel internal and external customers. The cost saving is estimated to be approximately $10M cost saving following this design guidelines, more cost saving are expected if proliferate to other product platforms and establish good method for future product implementation. Our study shows that stitching capacitors have neither significantly improve nor degrade differential signal integrity performance on non-ideal return path. There is no direct relationship between the stitching capacitors and the frequency characteristics of the differential links on non-ideal return path. Before concluding this study, we perform time-domain analysis in HSPICE and Lab measurement was taken on actual system board for SATA and PCIe interfaces. All the eye diagram results captured are showing similar trend between simulation and measurement.
Keywords
capacitors; time-domain analysis; HSPICE; Lab measurement; PCIe interfaces; SATA; differential signal integrity performance; high-speed differential link; nonideal return path; platform stitching capacitor; simulation; time-domain analysis; Capacitors; Costs; Degradation; Frequency measurement; Guidelines; Impedance measurement; Insertion loss; Loss measurement; Performance evaluation; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2009. ASQED 2009. 1st Asia Symposium on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-4952-1
Electronic_ISBN
978-1-4244-4952-1
Type
conf
DOI
10.1109/ASQED.2009.5206266
Filename
5206266
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