Title :
How organic substrate structure & design improve assembly robustness
Author :
Low, B.Y. ; Ravishankar, R.
Author_Institution :
Freescale Semicond. (M) Sdn. Bhd., Petaling Jaya, Malaysia
Abstract :
This paper focuses on how the PBGA (plastic ball grid array) organic substrate structure and traces design improve the assembly packaging robustness. Via plugging process at the substrate fabrication has been studied. Comparison of substrate without via plug, laminate substrate with via plugging process increases the overall hardness of the substrate. This is due to the via plug materials use (IR6) is a harder materials than the solder resist. Another area of study is the addition of dummy traces design on the air venting area improves the solder resist evenness by elimination mold resin bleed.
Keywords :
ball grid arrays; solders; PBGA; air venting area; assembly packaging robustness; assembly robustness design; dummy traces; mold resin bleed elimination; organic substrate structure; plastic ball grid array; plug materials use; plugging process; solder resist; substrate fabrication; Assembly; Electrical resistance measurement; Laminates; Packaging; Plugs; Resins; Resists; Robustness; Substrates; Testing;
Conference_Titel :
Quality Electronic Design, 2009. ASQED 2009. 1st Asia Symposium on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-4952-1
Electronic_ISBN :
978-1-4244-4952-1
DOI :
10.1109/ASQED.2009.5206269
