A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems

Author

Lin, Chia-Yi ; Fang, Wai-Chi ; Chen, Hung-Ming ; Hsieh, Zong-Han ; Chen, Chiu-Kuo

Author_Institution

Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

fYear

2011

fDate

7-8 April 2011

Firstpage

9

Lastpage

13

Abstract

In this paper, a low noise and robust test scheme for 3D stacked integrated circuits based on modified standard IEEE 1149.4 has been proposed. Through the modified standard, this novel test scheme can be more robust to fulfill the microsystem integration requirements. This test scheme also makes the analog pins more observable and testable during and after the integration. The proposed test scheme is validated with preliminary results. This invention provides a useful test method to guide system designers to achieve a low noise and robust test scheme while designing system specifications.

Keywords

IEEE standards; bioMEMS; biomedical electronics; system-in-package; testing; 3D stacked integrated circuits; 3D system-in-package test scheme; highly integrated biomedical systems; microsystem integration; modified standard IEEE 1149.4; Conferences; Noise; Pins; Robustness; Testing; Three dimensional displays; Low noise; Robust; System-in-Package; Test scheme;

fLanguage

English

Publisher

ieee

Conference_Titel

Life Science Systems and Applications Workshop (LiSSA), 2011 IEEE/NIH

Conference_Location

Bethesda, MD

Print_ISBN

978-1-4577-0421-5

Type

conf

DOI

10.1109/LISSA.2011.5754142

Filename

5754142