DocumentCode
2997244
Title
Measurement of worst-case power delivery noise and construction of worst case current for graphics core simulation
Author
Tan, Fern Nee
Author_Institution
Penang Design Center, Intel Microelectron., Bayan Lepas, Malaysia
fYear
2009
fDate
15-16 July 2009
Firstpage
59
Lastpage
63
Abstract
Worst case graphics core power delivery noise is a major indicator of graphics chip performance. The design of good graphics core power delivery network (PDN) is technically difficult because it is not easy to predict a worst case current stimulus during pre-silicon design stage. Many times, the worst case power delivery noise is observed when graphics benchmark software is run during post-silicon validation. At times like this, it is too late to rectify the power delivery noise issue unless many extra capacitor placeholders are placed during early design stage. To intelligently optimize the graphics core power delivery network design and determining the right amount of decoupling capacitors, this paper suggests an approach that setup a working platform to capture the worst case power delivery noise; and later re-construct the worst case power delivery current using Thevenin´s Theorem. The measurement is based on actual gaming application instead of engineering a special stimulus that is generated thru millions of logic test-vectors. This approach is practical, direct and quick, and does not need huge computing resources; or technically skilled logic designers to design algorithms to build the stimulus.
Keywords
circuit simulation; deconvolution; logic circuits; microprocessor chips; network synthesis; Thevenin theorem; decoupling capacitors; graphic core simulation; logic designers; logic test-vectors; power delivery network; worst case current; worst-case power delivery noise; Algorithm design and analysis; Capacitors; Current measurement; Design optimization; Graphics; Intelligent networks; Logic testing; Noise measurement; Power measurement; Semiconductor device measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2009. ASQED 2009. 1st Asia Symposium on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-4952-1
Electronic_ISBN
978-1-4244-4952-1
Type
conf
DOI
10.1109/ASQED.2009.5206296
Filename
5206296
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