• DocumentCode
    2997305
  • Title

    Fair Access to External Memory for Chip-multiprocessor

  • Author

    Yang, Shufan ; Wu, Qiang ; Xiao, Xiongren ; Li, Renfa ; Hillenbrand, Dominic

  • Author_Institution
    Embedded Syst. & Networking Lab., Hunan Univ., Changsha, China
  • fYear
    2012
  • fDate
    21-25 May 2012
  • Firstpage
    300
  • Lastpage
    305
  • Abstract
    A memory arbitration scheme is required for chip-multiprocessor accessing external (off-chip) memory. A round-robin arbitration is an efficient and low-cost candidate for chip-multiprocessor. However, the adoption of simple round robin scheme raises a potential problem of uneven sharing of external memory bandwidth. One way to manage an unbalanced resource allocation resulting from the use of arbiters is to use priority arbitrations combined with a look-up table, but this is not economical since large lookup tables require a large silicon area. We propose an admission control scheme operating at the edge of on-chip interconnection. The fair-sharing service is guaranteed using a token mechanism to schedule packets onto fabric. This work shows that a fair service problem can be solved by controlling traffic of on-chip interconnect, since it avoid saturation in critical paths and to maintain equilibrium in the allocation of resource.
  • Keywords
    integrated circuit interconnections; microprocessor chips; resource allocation; table lookup; admission control scheme; chip-multiprocessor; external memory bandwidth; fair access; fair-sharing service; look-up table; low-cost candidate; memory arbitration scheme; off-chip memory; on-chip interconnection; priority arbitrations; round robin scheme; token mechanism; unbalanced resource allocation; Admission control; Bandwidth; Fabrics; Neurons; Nickel; Program processors; System-on-a-chip; chip-multiprocessor; external memory access; fairness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel and Distributed Processing Symposium Workshops & PhD Forum (IPDPSW), 2012 IEEE 26th International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-0974-5
  • Type

    conf

  • DOI
    10.1109/IPDPSW.2012.36
  • Filename
    6270655