DocumentCode :
2997973
Title :
Three-layer ferroelectrets from perforated Teflon®-PTFE films fused between two homogeneous Teflon®-FEP films
Author :
Basso, H.C. ; Alta, R.A.P. ; Mellinger, Axel ; Fang, W.P.W. ; Gerhard, Reimund
Author_Institution :
Univ. of Sao Paulo Sao Carlos, Sao Carlos
fYear :
2007
fDate :
14-17 Oct. 2007
Firstpage :
453
Lastpage :
456
Abstract :
In this contribution, we propose a new route towards polymer ferroelectrets with uniform voids: Two homogeneous Teflonreg-FEP films are separated by, but also thermally fused to a Teflonreg-PTFE film with several homogeneous holes. Closed voids with FEP top and bottom lids and PTFE walls are dius formed. After internally charging the top and bottom FEP layers with positive and negative polarity, respectively, the voids constitute large dipoles that can be deformed by mechanical or electrical stresses. Consequently, the three-layer sandwich exhibits direct and inverse piezoelectricity. The continuous layer-fusing process involves a press with hot cylindrical rolls that operate at temperatures up to 310degC, which may allow production of inexpensive transducer materials on a large scale. We report about the concept, the processing, the charging and the electromechanical performance of the three-layer ferroelectrets.
Keywords :
electrets; ferroelectric materials; ferroelectric thin films; multilayers; piezoelectricity; polymer films; sandwich structures; voids (solid); PTFE; closed voids; electrical stresses; electromechanical performance; mechanical stresses; piezoelectricity; polymer ferroelectrets; temperature 310 degC; three-layer ferroelectrets; three-layer sandwich; Biological materials; Dielectric materials; Dielectrics and electrical insulation; Electrets; Optical films; Physics; Piezoelectric films; Piezoelectric transducers; Polymer films; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
Conference_Location :
Vancouver, BC
Print_ISBN :
978-1-4244-1482-6
Electronic_ISBN :
978-1-4244-1482-6
Type :
conf
DOI :
10.1109/CEIDP.2007.4451625
Filename :
4451625
Link To Document :
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