Abstract :
This session includes seven papers that describe the recent significant progress in technology and applications of Micro-Electromechanical Systems (MEMS). Five of these papers are student papers. In the first paper, by Agah from the University of Michigan, the high-speed gas chromatography is described, relevant for many applications, where significant improvements have been achieved in time delay, resolution and power dissipation by the use of microfabricated columns. The second paper, from Sony and IMEC, addresses reliable and compact polymer-based packaging for RF-MEMS switches. The third paper, by Guan from Hong-Kong University of Science and Technology, demonstrates a fully integrated CMOS and high voltage compatible Rl-MEMS tkchnology. The fourth paper, by Abdelmoneum from the University of Michigan, presents a novel laser trimming procedure for micromechanical filters. Paper five, by Li from the Shanghai Institute of Microsystems and Information Technology, Chinese Academy of Sciences, reports a trenchsidewall single wafer MEMS technology and its accelerometer application. The sixth paper, by Jain from University of Florida, proposes an electrothermally actuated, dud mode micro mirror by using CMOS-MEMS process technology. The final paper in this session, by Zhu from Tsinghua University, illustrates the ultrasonic applications of ferroelectrical-based micro-acoustic devices.
