Title :
A reliable and compact polymer-based package for capacitive RF-MEMS switches
Author :
Oya, Y. ; Okubora, A. ; Van Spengen, M. ; Soussan, P. ; Stoukatch, S. ; Rottenberg, X. ; Ratchev, P. ; Tilmans, H. ; De Raedt, W. ; Beyne, E. ; De Moor, P. ; De Wolf, I. ; Baert, K.
Author_Institution :
Sony Corp., Atsugi, Japan
Abstract :
We present a package for capacitive RF-MEMS switches that is based on laminate substrates and BCB-sealed glass caps. The assembly is realised using standard packaging equipment. The package is only 1.1 mm thick, gross leak tight, has high mechanical strength, and passes accelerated lifetime testing. RF insertion loss was lower than 0.6 dB below 15 GHz. Capacitive switches packaged by the proposed method reach a lifetime of 107 cycles, and sustain 1000 h exposure at 85°C/85%RH.
Keywords :
electronics packaging; microswitches; polymers; reliability; 1.1 mm; BCB-sealed glass caps; RF insertion loss; capacitive RF-MEMS switches; compact polymer-based package; laminate substrates; package reliability; standard packaging equipment; Assembly; Glass; Laminates; Life estimation; Life testing; Packaging machines; Polymers; Radio frequency; Radiofrequency microelectromechanical systems; Switches;
Conference_Titel :
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
Print_ISBN :
0-7803-8684-1
DOI :
10.1109/IEDM.2004.1419056
