DocumentCode :
2998806
Title :
Very Large-Scale Integrated Processor
Author :
Takano, Shigeyuki
Author_Institution :
Sanyo LSI Design Syst. Soft Co., Ltd., Gunma, Japan
fYear :
2012
fDate :
21-25 May 2012
Firstpage :
821
Lastpage :
828
Abstract :
Many-core processors are designed for improving thread-level parallelism (TLP) across the cores and for keeping instruction-level parallelism (ILP) in each core. However, each application has its own characteristic TLP and ILP. Therefore, a "pre-fabricated" chip multiprocessor (CMP) cannot tolerate a wide range of applications. Recent works attempted to reconfigure the CMP in order to fit the processor to the applications. This paper proposes a scalable processor that is able to up scale and down scale the data path of the adaptive processor. The scaling is based on a chaining interconnection networks between segments. The adaptive processor uses a linear topology to form a stack structure. In order to map the array to a two-dimensional array, a new topology, which we call an S-topology which scales well is also proposed. We assessed costs in terms of area and delay on the S-topology applied to the adaptive processor, and peak performances.
Keywords :
VLSI; microprocessor chips; multi-threading; multiprocessing systems; multiprocessor interconnection networks; network topology; parallel architectures; reconfigurable architectures; CMP reconfiguration; ILP; S-topology; TLP; adaptive processor; instruction-level parallelism; interconnection networks; linear topology; many-core processors; pre-fabricated chip multiprocessor; scalable processor; stack structure; thread-level parallelism; two-dimensional array; very large scale integrated processor; Arrays; Multicore processing; Multiprocessor interconnection; Pipelines; Routing; Topology; Very large scale integration; Adaptive Computing; Composable Processor; Fusion Core; Reconfigurable Computing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Parallel and Distributed Processing Symposium Workshops & PhD Forum (IPDPSW), 2012 IEEE 26th International
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-0974-5
Type :
conf
DOI :
10.1109/IPDPSW.2012.101
Filename :
6270724
Link To Document :
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