• DocumentCode
    2999178
  • Title

    Optimizing Data Allocation and Memory Configuration for Non-Volatile Memory Based Hybrid SPM on Embedded CMPs

  • Author

    Hu, Jingtong ; Zhuge, Qingfeng ; Xue, Chun Jason ; Tseng, Wei-Che ; Sha, Edwin H M

  • Author_Institution
    Dept. of Comput. Sci., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2012
  • fDate
    21-25 May 2012
  • Firstpage
    982
  • Lastpage
    989
  • Abstract
    The recent emergence of various Non-Volatile Memories (NVMs), with many attractive characteristics such as low leakage power and high-density, provides us with a new way of addressing the memory power consumption problem. In this paper, we target embedded CMPs, and propose a novel Hybrid Scratch Pad Memory (HSPM) architecture which consists of SRAM and NVM to take advantage of the ultra-low leakage power, high density of NVM and fast read of SRAM. A novel data allocation algorithm as well as an algorithm to determine NVM/SRAM ratio for the novel HSPM architecture are proposed. The experimental results show that the data allocation algorithm can reduce the memory access time by 31.22% and the dynamic energy consumption by 15.35% on average for the HSPM architecture when compared with a greedy algorithm.
  • Keywords
    SRAM chips; embedded systems; greedy algorithms; memory architecture; multiprocessing systems; power aware computing; HSPM architecture; NVM-SRAM ratio; chip multiprocessors; data allocation optimization; embedded CMP; greedy algorithm; hybrid scratch pad memory architecture; memory configuration; memory power consumption problem; nonvolatile memory based hybrid SPM; Heuristic algorithms; Memory management; Nonvolatile memory; Random access memory; Resource management; System-on-a-chip; Data allocation; MRAM; NVM; PCM; SPM; energy; on-chip memory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel and Distributed Processing Symposium Workshops & PhD Forum (IPDPSW), 2012 IEEE 26th International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-0974-5
  • Type

    conf

  • DOI
    10.1109/IPDPSW.2012.120
  • Filename
    6270745