Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

Author

Czernohorsky, Julia ; Maj, Bartosz ; Viering, Matthias ; Wright, Lance ; Balanon, Gerry

Author_Institution

Continental Teves AG, Frankfurt

fYear

2007

fDate

17-19 Sept. 2007

Firstpage

38

Lastpage

42

Abstract

Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).

Keywords

application specific integrated circuits; integrated circuit packaging; microassembling; polymers; solders; thermal management (packaging); ASIC; epoxy die attach; heat sources; package assembly; power package; solder die attach; thermal investigation; Assembly; Diodes; Electronic design automation and methodology; Electrostatic discharge; Microassembly; Packaging; Performance evaluation; Power measurement; Temperature measurement; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on

Conference_Location

Budapest

Print_ISBN

978-2-35500-002-7

Type

conf

DOI

10.1109/THERMINIC.2007.4451743

Filename

4451743