Title :
A novel VLSI technology to manufacture high-density thermoelectric cooling devices
Author :
Chen, Howard ; Hsu, Louis ; Wei, Xiaojin
Author_Institution :
IBM Corp., New York
Abstract :
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability.
Keywords :
cooling; monolithic integrated circuits; temperature control; thermal management (packaging); thermoelectric devices; wafer-scale integration; ambient temperature; heat flux; high-density thermoelectric cooling devices; liquid cooling technology; novel VLSI technology; novel integrated circuit technology; phase-change cooling; semiconductor wafer; solid-state cooling technology; temperature control; traditional air cooling; Cooling; Heating; Integrated circuit manufacture; Integrated circuit technology; Pulp manufacturing; Semiconductor device manufacture; Temperature control; Thermoelectric devices; Thermoelectricity; Very large scale integration;
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451749
