Title :
The effect of ultrasonic frequency on fine pitch aluminum wedge wirebond
Author :
Gonzalez, Bill ; Knecht, Sheera ; Handy, Howard ; Ramirez, Jose
Author_Institution :
Digital Equipment Corp., Hudson, MA, USA
Abstract :
This paper describes an analysis of the effect of ultrasonic frequency on aluminum wedge bonds. Wire tensile strength, initial bond force, and ultrasonic power were varied for processes using a standard 60 kHz and a new 120 kHz transducer. Responses measured included wire pull strength and the probability of wire pull lifts, bond width, and bond pad metal “splash”. A comparison was made between the two transducers using the methods of designed experiments
Keywords :
aluminium; fine-pitch technology; lead bonding; tensile strength; ultrasonic welding; 120 kHz; 60 kHz; Al; Al wedge wirebond; US transducers; bond pad metal splash; bond width; fine pitch wirebond; initial bond force; tensile strength; ultrasonic frequency; ultrasonic power; wire pull lifts; wire pull strength; Aluminum; Bonding forces; Design methodology; Frequency; Manufacturing industries; Manufacturing processes; Semiconductor device manufacture; Ultrasonic transducers; Ultrasonic variables measurement; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550816
