Title :
SRAM design for nanoscale technology with Dynamic Vth and dynamic standby voltage for leakage reduction
Author :
Singh, Yogang ; Boolchandani, D.
Author_Institution :
Electron. & Commun. Eng. Dept., Malaviya Nat. Inst. of Technol., Jaipur, India
Abstract :
Present mobile applications demand for devices with low power and high speed. With continuous technology scaling power dissipation due to leakage currents has became biggest challenges of VLSI industry in designing of these high speed and low power devices. With projected large memory con-tent of future systems on chip devices, it is important to consider the leakage current in Static Random Access Memory (SRAM) structures. Literature contains various proposed leakage current reduction techniques for SRAM cell such as Data retention gated ground scheme, Dynamic threshold, Multi threshold SRAM, Sleep transistor based SRAM etc. This work focuses on design of SRAM cell with dynamic Vth and dynamic standby voltage to mitigate the leakage power dissipation. Simulation results show significant reduction in power dissipation in standby mode of SRAM cell.
Keywords :
CMOS integrated circuits; SRAM chips; VLSI; integrated circuit design; leakage currents; power aware computing; system-on-chip; transistor circuits; CMOS devices technology; VLSI industry; continuous technology scaling power dissipation; data retention gated ground scheme; dynamic Vth voltage; dynamic standby voltage; dynamic threshold SRAM design; future systems-on-chip devices; leakage current reduction techniques; leakage power dissipation mitigation; mobile applications; multithreshold SRAM design; nanoscale technology; sleep transistor based SRAM design; static random access memory structures; Leakage currents; Logic gates; Power dissipation; SRAM cells; Threshold voltage; Transistors; component; formatting; insert; style; styling;
Conference_Titel :
Signal Processing and Communication (ICSC), 2013 International Conference on
Conference_Location :
Noida
Print_ISBN :
978-1-4799-1605-4
DOI :
10.1109/ICSPCom.2013.6719838