DocumentCode
2999512
Title
Investigation of micro porosity sintered wick in vapor chamber for fan less design
Author
Yu, C.S. ; Wei, W.C. ; Kang, S.W.
Author_Institution
Tamkang Univ., Taipei
fYear
2007
fDate
17-19 Sept. 2007
Firstpage
88
Lastpage
91
Abstract
Micro Porosity Sintered wick is made from metal injection molding processes, which provides a wick density with micro scale. It can keep more than 53% working fluid inside the wick structure, and presents good pumping ability on working fluid transmission by fine infiltrated effect. Capillary pumping ability is the important factor in heat pipe design, and those general applications on wick structure are manufactured with groove type or screen type. Gravity affects capillary of these two types more than a sintered wick structure does, and mass heat transfer through vaporized working fluid determines the thermal performance of a vapor chamber. First of all, high density of porous wick supports high transmission ability of working fluid. The wick porosity is sintered in micro scale, which limits the bubble size while working fluid vaporizing on vapor section. Maximum heat transfer capacity increases dramatically as thermal resistance of wick decreases. This study on permeability design of wick structure is 0.5-0.7, especially permeability (R)=0.5 can have the best performance, and its heat conductivity is 20 times to a heat pipe with diameter (Phi)=10 mm. Test data of this vapor chamber shows thermal performance increases over 33 %.
Keywords
capillarity; confined flow; heat transfer; injection moulding; mass transfer; porosity; porous materials; structural engineering; capillary pumping ability; fan less design; fine infiltrated effect; heat conductivity; heat pipe design; mass heat transfer; metal injection molding processes; microporosity sintered wick; permeability; vapor chamber; working fluid; Conductivity; Gravity; Heat pumps; Heat transfer; Injection molding; Manufacturing; Permeability; Resistance heating; Testing; Thermal resistance; Heat transfer; Sintered wick structure; Vapor chamber; fan less;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451753
Filename
4451753
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