Title :
Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Author :
Wunderle, B. ; Braun, T. ; May, D. ; Mazloum, A. ; Bouazza, M. ; Walter, H. ; Wittier, O. ; Schacht, R. ; Becker, K.-F. ; Schneider-Ramelow, M. ; Michel, B. ; Reichl, H.
Author_Institution :
Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin
Abstract :
The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is shown that an in-situ capacitance measurement is a convenient method to detect these failures unambiguously. Finite Element simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given.
Keywords :
ceramic capacitors; crack detection; failure analysis; nondestructive testing; reliability; surface mount technology; capacitor integrity; crack detection; encapsulated miniature SMD ceramic chip capacitors; finite element simulation; mechanical loading; multilayer ceramic chip capacitors; nondestructive failure analysis; nondestructive failure modeling; reliability estimate; thermal loading; Acoustic signal detection; Capacitors; Ceramics; Copper; Encapsulation; Failure analysis; Lead; Packaging; Thermal loading; Thermal stresses;
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451756
