DocumentCode
2999662
Title
Area optimization of packing represented by sequence-pair
Author
Ohmura, Tomokazu ; Fujiyoshi, Kunihiro ; Kodama, Chikaaki
Author_Institution
Dept. of Electr. & Electron. Eng., Tokyo Univ. of Agric. & Technol., Japan
fYear
2000
fDate
2000
Firstpage
813
Lastpage
816
Abstract
In the rectangle packing, “area optimization problem”, to minimize the whole area by rotating rectangles by 90 degrees, is proved to be NP-hard. But it can be solved in O(n2) time if the packing is restricted to a slicing structure. We propose a method using a local slicing structure to solve the problem efficiently. The packing is represented by a sequence-pair and the necessary and sufficient condition for the maximum local slicing structure is presented and proved. The experimental results show the effectiveness of the proposed method
Keywords
VLSI; circuit complexity; circuit layout CAD; circuit optimisation; integrated circuit layout; minimisation; NP-hard problem; VLSI layout design; local slicing structure; packing area optimization; rectangle packing; sequence-pair representation; Agricultural engineering; Agriculture; Circuit topology; Cost function; Integrated circuit interconnections; Optimization methods; Performance evaluation; Stochastic processes; Very large scale integration; Wheels;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2000. IEEE APCCAS 2000. The 2000 IEEE Asia-Pacific Conference on
Conference_Location
Tianjin
Print_ISBN
0-7803-6253-5
Type
conf
DOI
10.1109/APCCAS.2000.913645
Filename
913645
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