Title :
High-performance thermal interface technology overview
Author :
Linderman, R. ; Brunschwiler, T. ; Smith, B. ; Michel, B.
Author_Institution :
IBM Res. GmbH, Zurich
Abstract :
An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.
Keywords :
integrated circuit testing; reliability; thermal resistance; chips power density; high-performance thermal interface technology; nested hierarchical surface channels; particle-filled materials; reliability testing; thermal cycling; Assembly; Bonding; Conducting materials; Electronic packaging thermal management; Immune system; Inorganic materials; Thermal conductivity; Thermal loading; Thermal resistance; Viscosity;
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451762
