A new methodology for extraction of dynamic compact thermal models

Author

Habra, W. ; Tounsi, Patrick ; Madrid, F. ; Dupuy, P. ; Barbot, C. ; Dorkel, Jean-Marie

Author_Institution

Univ. of Toulouse, Toulouse

fYear

2007

fDate

17-19 Sept. 2007

Firstpage

141

Lastpage

144

Abstract

An innovative and accurate dynamic compact thermal model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the optimal thermal coupling point, which is proven to be valid even for transient modelling. Compared to the existing methods, the number of needed 3D thermal simulations or measurements is significantly reduced.

Keywords

multichip modules; power electronics; semiconductor device models; semiconductor device packaging; thermal management (packaging); 3D thermal simulation; dynamic compact thermal models; multichip power electronics systems; multiple heat sources; optimal thermal coupling point; transient electro-thermal coupling; Automotive engineering; Coupling circuits; Electronic packaging thermal management; MOSFETs; Power electronics; Power engineering and energy; Power system modeling; Temperature; Vehicle dynamics; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on

Conference_Location

Budapest

Print_ISBN

978-2-35500-002-7

Type

conf

DOI

10.1109/THERMINIC.2007.4451766

Filename

4451766