• DocumentCode
    2999807
  • Title

    Fully integrated one phase liquid cooling system for organic boards

  • Author

    May, D. ; Wunderle, B. ; Schindler-Saefkow, F. ; Nguyen, B. ; Schacht, R. ; Michel, B. ; Reichl, H.

  • Author_Institution
    Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin
  • fYear
    2007
  • fDate
    17-19 Sept. 2007
  • Firstpage
    150
  • Lastpage
    155
  • Abstract
    Prime concerns in designing liquid cooling solutions are performance, reliability and price. To that end a one-phase liquid cooling concept is proposed, where all pumps, valves and piping are fully integrated on board level. Only low-cost organic board technology and SMT processes are used in the design. This paper addresses the key issues of such a concept together with some numerical and first experimental results. It is highlighted that for such a concept a special type of membrane pump with adequate valve technology is especially suitable. Design guidelines as to its performance are given. Eventually, the obtained results are evaluated with respect to the requirements and necessary further developments are commented on to make the concept eligible for the cost-performance-sector.
  • Keywords
    cooling; microchannel flow; micropumps; microvalves; printed circuits; pumps; surface mount technology; thermal management (packaging); SMT processes; integrated one-phase liquid cooling system; low-cost organic board technology; membrane pump; microchannels; piping system; valve technology; Actuators; Biomembranes; Circuit testing; Costs; Heat pumps; Liquid cooling; Reservoirs; Surface-mount technology; Valves; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-2-35500-002-7
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2007.4451768
  • Filename
    4451768