DocumentCode
2999807
Title
Fully integrated one phase liquid cooling system for organic boards
Author
May, D. ; Wunderle, B. ; Schindler-Saefkow, F. ; Nguyen, B. ; Schacht, R. ; Michel, B. ; Reichl, H.
Author_Institution
Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin
fYear
2007
fDate
17-19 Sept. 2007
Firstpage
150
Lastpage
155
Abstract
Prime concerns in designing liquid cooling solutions are performance, reliability and price. To that end a one-phase liquid cooling concept is proposed, where all pumps, valves and piping are fully integrated on board level. Only low-cost organic board technology and SMT processes are used in the design. This paper addresses the key issues of such a concept together with some numerical and first experimental results. It is highlighted that for such a concept a special type of membrane pump with adequate valve technology is especially suitable. Design guidelines as to its performance are given. Eventually, the obtained results are evaluated with respect to the requirements and necessary further developments are commented on to make the concept eligible for the cost-performance-sector.
Keywords
cooling; microchannel flow; micropumps; microvalves; printed circuits; pumps; surface mount technology; thermal management (packaging); SMT processes; integrated one-phase liquid cooling system; low-cost organic board technology; membrane pump; microchannels; piping system; valve technology; Actuators; Biomembranes; Circuit testing; Costs; Heat pumps; Liquid cooling; Reservoirs; Surface-mount technology; Valves; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451768
Filename
4451768
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