Title :
Low-cost fabrication of optical subassemblies
Author :
Cohen, M.S. ; Johnson, G.W. ; Trewhella, J.M. ; Lacey, D.L. ; Oprysko, M.M. ; Karst, D.L. ; DeFoster, S.M. ; Hogan, W.K. ; Peterson, M.D. ; Weirick, J.A.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The optical subassembly is a major contributor to the cost of a fiberoptic computer data link. A technology for low-cost fabrication of optical subassemblies is described, with emphasis on the transmitter subassembly. A factor of three cost reduction is achieved by limiting the parts count to only three: a laser or receiver chip packaged in a TO-can, a plastic housing, and a plastic aspheric lens; and by employment of a fast, automated active-alignment and subsequent fixing technique. Key enabling features include the rise of precision injection molding of specially chosen plastics, an aspheric lens design which permits wide positional variations in the axial direction, and curing of a fast setting epoxy through the use of RF power. A tool was constructed which produced subassemblies at high yield having satisfactory performance
Keywords :
assembling; optical fabrication; optical transmitters; RF power; TO-can; automated active-alignment; epoxy curing; fiberoptic computer data link; fixing technique; injection molding; laser chip; low-cost fabrication; optical subassembly; packaging; parts count; plastic aspheric lens; plastic housing; receiver chip; transmitter; yield; Costs; Employment; Fiber lasers; Injection molding; Lenses; Optical computing; Optical device fabrication; Optical receivers; Optical transmitters; Plastic packaging;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550818