• DocumentCode
    2999911
  • Title

    A modular high temperature measurement set-up for semiconductor device characterization

  • Author

    Borthen, Peter ; Wachutka, Gerhard

  • Author_Institution
    Munich Univ. of Technol., Munich
  • fYear
    2007
  • fDate
    17-19 Sept. 2007
  • Firstpage
    189
  • Lastpage
    194
  • Abstract
    We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room temperature up to 500degC and higher. A detailed description of the experimental equipment is given. Its practical use is demonstrated by measuring temperature-dependent characteristics of silicon VDMOSFET and IGBT devices as well as SiC-diodes. For the silicon devices, numerical simulations based on recently developed high temperature physical models were also performed in order to gain a deeper understanding of the measured data, together with a revalidation of the model parameters.
  • Keywords
    MOSFET; insulated gate bipolar transistors; semiconductor device measurement; IGBT device; high temperature physical model; insulated gate bipolar transistor; modular high temperature measurement set-up; numerical simulation; semiconductor device characterization; silicon device; temperature-dependent characteristics; Gain measurement; Insulated gate bipolar transistors; Numerical simulation; Performance evaluation; Performance gain; Semiconductor device testing; Semiconductor devices; Silicon devices; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-2-35500-002-7
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2007.4451775
  • Filename
    4451775