DocumentCode
2999911
Title
A modular high temperature measurement set-up for semiconductor device characterization
Author
Borthen, Peter ; Wachutka, Gerhard
Author_Institution
Munich Univ. of Technol., Munich
fYear
2007
fDate
17-19 Sept. 2007
Firstpage
189
Lastpage
194
Abstract
We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room temperature up to 500degC and higher. A detailed description of the experimental equipment is given. Its practical use is demonstrated by measuring temperature-dependent characteristics of silicon VDMOSFET and IGBT devices as well as SiC-diodes. For the silicon devices, numerical simulations based on recently developed high temperature physical models were also performed in order to gain a deeper understanding of the measured data, together with a revalidation of the model parameters.
Keywords
MOSFET; insulated gate bipolar transistors; semiconductor device measurement; IGBT device; high temperature physical model; insulated gate bipolar transistor; modular high temperature measurement set-up; numerical simulation; semiconductor device characterization; silicon device; temperature-dependent characteristics; Gain measurement; Insulated gate bipolar transistors; Numerical simulation; Performance evaluation; Performance gain; Semiconductor device testing; Semiconductor devices; Silicon devices; Temperature distribution; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451775
Filename
4451775
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