Title :
Environmental leadership in electronics manufacturing: lead-free and beyond
Author :
Shangguan, Dongkai
Author_Institution :
Flextronics, San Jose, CA, USA
Abstract :
This paper reviews the strategy and methodology for meeting the challenges of environmental leadership for the transition to WEEE/RoHS compliance in electronics manufacturing, including the key compatibility issues involved in lead-free soldering, supply chain compliance, compliance assurance management, design for the environment, and recycling for product end-of-life management.
Keywords :
circuit reliability; design for environment; electronics industry; electronics packaging; printed circuit manufacture; recycling; reflow soldering; reviews; solders; wave soldering; WEEE/RoHS compliance; compatibility issues; compliance assurance management; design for environment; electronics manufacturing; environmental leadership; functional signature analysis methodology; hazardous substances; lead-free soldering; product end-of-life management; recycling; reflow soldering; remaining life; rework processes; solderability; supply chain compliance; wave soldering; Costs; Electronic waste; Environmental management; Environmentally friendly manufacturing techniques; Gold alloys; Laminates; Lead; Recycling; Soldering; Supply chain management;
Conference_Titel :
Electronics and the Environment, 2004. Conference Record. 2004 IEEE International Symposium on
Print_ISBN :
0-7803-8250-1
DOI :
10.1109/ISEE.2004.1299684
