DocumentCode
2999929
Title
Thermal management and thermal resistance of high power LEDs
Author
Zahner, Thomas
Author_Institution
OSRAM Opto Semicond., Regensburg
fYear
2007
fDate
17-19 Sept. 2007
Firstpage
195
Lastpage
195
Abstract
Summary form given only. The junction temperature of Light Emitting Diodes (LEDs) is a primary reliability parameter. Exceeding the maximum rated junction temperature could lead to accelerated light output degradation and sometimes even to catastrophic failures. Besides that junction temperature influences the desired LED properties in applications like light output efficiency, dominant wavelength and forward voltage. Therefore thermal management and proper thermal characterisation of high power LEDs is very important for a reliable product with good performance. By measuring the thermal resistance of a high power LED it has to take into account that the power applied to the device is converted into heat and light (-20-40% efficiency). This means that the thermal resistance of a LED can not be determined without knowing the energy flux emitted as light. Therefore in general the interpretation of a given thermal resistance of an optoelectronic device is not well defined. Establishing of a standard on how to do thermal resistance measurement for light emitting devices is necessary.
Keywords
light emitting diodes; semiconductor device measurement; semiconductor device packaging; thermal management (packaging); thermal resistance measurement; accelerated light output degradation; catastrophic failures; high power LED; light emitting diode junction temperature; light output efficiency; maximum rated junction temperature; optoelectronic device; primary reliability parameter; thermal characterisation; thermal management; thermal resistance measurement; Acceleration; Electrical resistance measurement; Energy management; Light emitting diodes; Power measurement; Temperature; Thermal degradation; Thermal management; Thermal resistance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451776
Filename
4451776
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