• DocumentCode
    2999929
  • Title

    Thermal management and thermal resistance of high power LEDs

  • Author

    Zahner, Thomas

  • Author_Institution
    OSRAM Opto Semicond., Regensburg
  • fYear
    2007
  • fDate
    17-19 Sept. 2007
  • Firstpage
    195
  • Lastpage
    195
  • Abstract
    Summary form given only. The junction temperature of Light Emitting Diodes (LEDs) is a primary reliability parameter. Exceeding the maximum rated junction temperature could lead to accelerated light output degradation and sometimes even to catastrophic failures. Besides that junction temperature influences the desired LED properties in applications like light output efficiency, dominant wavelength and forward voltage. Therefore thermal management and proper thermal characterisation of high power LEDs is very important for a reliable product with good performance. By measuring the thermal resistance of a high power LED it has to take into account that the power applied to the device is converted into heat and light (-20-40% efficiency). This means that the thermal resistance of a LED can not be determined without knowing the energy flux emitted as light. Therefore in general the interpretation of a given thermal resistance of an optoelectronic device is not well defined. Establishing of a standard on how to do thermal resistance measurement for light emitting devices is necessary.
  • Keywords
    light emitting diodes; semiconductor device measurement; semiconductor device packaging; thermal management (packaging); thermal resistance measurement; accelerated light output degradation; catastrophic failures; high power LED; light emitting diode junction temperature; light output efficiency; maximum rated junction temperature; optoelectronic device; primary reliability parameter; thermal characterisation; thermal management; thermal resistance measurement; Acceleration; Electrical resistance measurement; Energy management; Light emitting diodes; Power measurement; Temperature; Thermal degradation; Thermal management; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-2-35500-002-7
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2007.4451776
  • Filename
    4451776