DocumentCode :
2999929
Title :
Thermal management and thermal resistance of high power LEDs
Author :
Zahner, Thomas
Author_Institution :
OSRAM Opto Semicond., Regensburg
fYear :
2007
fDate :
17-19 Sept. 2007
Firstpage :
195
Lastpage :
195
Abstract :
Summary form given only. The junction temperature of Light Emitting Diodes (LEDs) is a primary reliability parameter. Exceeding the maximum rated junction temperature could lead to accelerated light output degradation and sometimes even to catastrophic failures. Besides that junction temperature influences the desired LED properties in applications like light output efficiency, dominant wavelength and forward voltage. Therefore thermal management and proper thermal characterisation of high power LEDs is very important for a reliable product with good performance. By measuring the thermal resistance of a high power LED it has to take into account that the power applied to the device is converted into heat and light (-20-40% efficiency). This means that the thermal resistance of a LED can not be determined without knowing the energy flux emitted as light. Therefore in general the interpretation of a given thermal resistance of an optoelectronic device is not well defined. Establishing of a standard on how to do thermal resistance measurement for light emitting devices is necessary.
Keywords :
light emitting diodes; semiconductor device measurement; semiconductor device packaging; thermal management (packaging); thermal resistance measurement; accelerated light output degradation; catastrophic failures; high power LED; light emitting diode junction temperature; light output efficiency; maximum rated junction temperature; optoelectronic device; primary reliability parameter; thermal characterisation; thermal management; thermal resistance measurement; Acceleration; Electrical resistance measurement; Energy management; Light emitting diodes; Power measurement; Temperature; Thermal degradation; Thermal management; Thermal resistance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
Type :
conf
DOI :
10.1109/THERMINIC.2007.4451776
Filename :
4451776
Link To Document :
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