Title :
Circuit modeling to predict the performance of force-cooled cold plate structures
Author :
Pieper, Ronald J. ; Michael, Sherif
Author_Institution :
Dept. of Electr. & Comput. Eng., Naval Postgraduate Sch., Monterey, CA, USA
Abstract :
The electronic circuit simulator PSpice can provide the means of obtaining numerical nonanalytic solutions to thermal heat flow problems which would otherwise be difficult or impossible to derive. Rules for relating physical heat flow parameters to equivalent distributed lossy transmission line parameters are derived. This method for numerical evaluation of the heat dissipating performance of complicated fin structures forming cold-stacks is validated by comparison with recently published analytic solutions for double stack cold plates
Keywords :
SPICE; cooling; digital simulation; packaging; PSpice; circuit modeling; complicated fin structures; double stack cold plates; electronic circuit simulator; equivalent distributed lossy transmission line parameters; force-cooled cold plate structures; numerical nonanalytic solutions; thermal heat flow problems; Analytical models; Circuits; Cold plates; Differential equations; Electronics packaging; Performance analysis; Performance loss; Power transmission lines; Predictive models; Propagation losses;
Conference_Titel :
Circuits and Systems, 1999. ISCAS '99. Proceedings of the 1999 IEEE International Symposium on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-5471-0
DOI :
10.1109/ISCAS.1999.780106
