DocumentCode
3001309
Title
RF power potential of 90 nm CMOS: device options, performance, and reliability
Author
Scholvin, Jörg ; Greenberg, David R. ; del Alamo, Jesús A.
Author_Institution
MIT, Cambridge, MA, USA
fYear
2004
fDate
13-15 Dec. 2004
Firstpage
455
Lastpage
458
Abstract
This paper presents the first detailed comparative study of the RF power potential of the various device options offered in a state-of-the-art 90 nm CMOS foundry technology. We show that at a constant voltage of 1 V, the nominal 90 nm thin gate-oxide logic devices offer the best performance, at Vdd = 1 V and 2.2 GHz showing over 20 dBm of output power and 59% PAE, as well as a power density of 34 mW/mm and 59% PAE at 8 GHz. If the operating voltage can be selected, 250 nm long thick gate-oxide I/O devices offer the highest power and efficiency at 2.5 V. However, when reliability considerations are included, the 90 nm digital devices outperform the 250 nm I/O devices. Overall, we find that the RF power performance of 90 nm CMOS exceeds the requirements for power amplifiers in a large variety of wireless high volume applications.
Keywords
CMOS digital integrated circuits; integrated circuit reliability; microwave power amplifiers; 1 V; 2.2 GHz; 2.5 V; 250 nm; 90 nm; CMOS; RF power potential; device options; device performance; device reliability; digital devices; power amplifiers; thin gate-oxide logic devices; wireless high volume applications; CMOS technology; Costs; FETs; Fingers; Foundries; Logic devices; Modems; Power generation; Radio frequency; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
Print_ISBN
0-7803-8684-1
Type
conf
DOI
10.1109/IEDM.2004.1419186
Filename
1419186
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