• DocumentCode
    3001318
  • Title

    Compatibility of the RGS silicon wafer with industrial type solar cell processing

  • Author

    Schönecker, A. ; Gutjahr, A. ; Burgers, A.R. ; Seren, S. ; Hahn, G.

  • Author_Institution
    RGS Dev. B.V., Oudkarspel
  • fYear
    2008
  • fDate
    July 28 2008-Aug. 1 2008
  • Firstpage
    232
  • Lastpage
    237
  • Abstract
    The ribbon-growth-on-substrate (RGS) silicon wafer technology is a unique casting technology for the next generation of silicon wafer manufacturing for photovoltaic application. Compared to today´s cut wafer technology, the silicon yield is increased from about 40% to more than 90% due to the direct casting. This in combination with the high production volume per machine and year makes RGS wafers a promising technology for the next step towards cost effective solar electricity. However, for a successful implementation of this technology in the market, not only the wafer manufacturing process but also the compatibility of the RGS wafers with today´s solar cell lines has to be demonstrated. This paper presents an overview on the lessons learned in the last 7 years of solar cell processing of RGS wafers manufactured with the laboratory equipment at ECN.
  • Keywords
    casting; elemental semiconductors; silicon; solar cells; RGS silicon wafer; Si; cut wafer technology; direct casting; industrial type solar cell processing; photovoltaic application; ribbon-growth-on-substrate silicon wafer technology; solar cell processing; wafer manufacturing; Casting; Costs; Manufacturing industries; Manufacturing processes; Photovoltaic cells; Photovoltaic systems; Production; Pulp manufacturing; Silicon; Solar power generation; Silicon wafer casting; solar cells; wafer characteristics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials and Devices, 2008. COMMAD 2008. Conference on
  • Conference_Location
    Sydney, SA
  • ISSN
    1097-2137
  • Print_ISBN
    978-1-4244-2716-1
  • Electronic_ISBN
    1097-2137
  • Type

    conf

  • DOI
    10.1109/COMMAD.2008.4802134
  • Filename
    4802134