• DocumentCode
    3001472
  • Title

    A novel SPICE behavioral macromodel of operational amplifiers including a high accuracy description of frequency characteristics

  • Author

    Maxim, Adrian ; Andreu, Danielle ; Cousineau, Marc ; Boucher, Jacques

  • Author_Institution
    Dept. of Electron. & Telecommun., Tech. Univ., Isai, Romania
  • Volume
    6
  • fYear
    1999
  • fDate
    36342
  • Firstpage
    278
  • Abstract
    This paper presents a new method of operational amplifiers SPICE macromodeling, based on a frequency domain description of the input-output transfer functions. It accurately models the frequency variations of the open-loop gain, the common-mode rejection, and the input and output impedances, by a direct specification of their Laplace domain expressions, with all theirs dominant poles and zeros. The temperature dependencies of the main OpAmp´s characteristics and the equivalent input noise are included. The proposed behavioral macromodel leads to a higher computational efficiency in comparison with the existing OpAmp SPICE models, with a higher accuracy and a better convergence
  • Keywords
    Laplace transforms; SPICE; circuit CAD; computational complexity; operational amplifiers; transfer functions; Laplace domain expressions; SPICE behavioral macromodel; SPICE macromodeling; SPICE models; behavioral macromodel; characteristics; common-mode rejection; computational efficiency; convergence; dominant poles; dominant zeros; equivalent input noise; frequency characteristics; frequency domain description; frequency variations; high accuracy description; input impedances; input-output transfer functions; open-loop gain; operational amplifiers; output impedances; temperature dependencies; Convergence; Equations; Frequency domain analysis; Impedance; Operational amplifiers; Power supplies; SPICE; Temperature dependence; Transfer functions; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1999. ISCAS '99. Proceedings of the 1999 IEEE International Symposium on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-5471-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.1999.780149
  • Filename
    780149