• DocumentCode
    3001572
  • Title

    Plasma dry etching for selective emitter formation in crystalline silicon based solar cell

  • Author

    Tucci, Mario ; Serenelli, Luca ; Del Bono, Alberto ; Izzi, Massimo ; Pirozzi, Luisa ; Martufi, Pierino ; Sanseverino, Annunziata

  • Author_Institution
    ENEA Res. Center, Rome
  • fYear
    2008
  • fDate
    July 28 2008-Aug. 1 2008
  • Firstpage
    273
  • Lastpage
    276
  • Abstract
    Selective emitter formation in silicon based solar cell is recently becoming a common technique to enhance the blue response of solar cell. In this work, we suggest a novel procedure based on a self alignment thought to overcome the realignment problems that still limit its industrial request. The idea is based on a plasma dry etching procedure of the emitter region using the metal grid of the cell as a mask. In particular the plasma etching can reduce the thickness of a homogeneous heavily doped emitter reducing both doping concentration and sheet resistance. Since there is no necessity of realignment step in the proposed selective emitter fabrication process it can be useful and appealing for industrial PV manufacturing.
  • Keywords
    elemental semiconductors; semiconductor doping; silicon; solar cells; sputter etching; Si; crystalline silicon-based solar cell; doping concentration; heavy-doped homogeneous emitter; industrial PV manufacturing; metal grid; plasma dry etching; selective emitter formation; sheet resistance; Crystallization; Doping; Dry etching; Fabrication; Manufacturing industries; Photovoltaic cells; Plasma applications; Plasma materials processing; Silicon; Textile industry; boron diffusion; component; dry etching; plasma; selective emitter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials and Devices, 2008. COMMAD 2008. Conference on
  • Conference_Location
    Sydney, SA
  • ISSN
    1097-2137
  • Print_ISBN
    978-1-4244-2716-1
  • Electronic_ISBN
    1097-2137
  • Type

    conf

  • DOI
    10.1109/COMMAD.2008.4802145
  • Filename
    4802145