DocumentCode
3001830
Title
Nanometric three-dimensional sub-surface imaging of a silicon flip-chip
Author
Ramsay, E. ; Serrels, K.A. ; Thomson, M.J. ; Waddie, A.J. ; Warburton, R.J. ; Taghizadeh, M.R. ; Rei, D.T.
Author_Institution
Heriot-Watt Univ., Edinburgh
fYear
2007
fDate
6-11 May 2007
Firstpage
1
Lastpage
2
Abstract
By implementing two-photon optical-beam-induced-current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166 nm lateral resolution and an axial resolution capable of resolving features only 100 nm deep.
Keywords
elemental semiconductors; flip-chip devices; lenses; optical microscopy; silicon; two-photon processes; nanometric imaging; optical-beam-induced-current microscopy; silicon flip-chip; solid-immersion lens; subsurface imaging; three-dimensional imaging; two-photon microscopy; Focusing; High-resolution imaging; Image resolution; Lenses; Optical imaging; Optical microscopy; Optical refraction; Optical variables control; Silicon; Ultrafast optics;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2007. CLEO 2007. Conference on
Conference_Location
Baltimore, MD
Print_ISBN
978-1-55752-834-6
Type
conf
DOI
10.1109/CLEO.2007.4452417
Filename
4452417
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