DocumentCode
3002294
Title
Analyzing interconnection design safety using bent pin analysis
Author
Ozarin, Nathaniel W.
Author_Institution
Omnicon Group Inc., Hauppauge, NY, USA
fYear
2011
fDate
24-27 Jan. 2011
Firstpage
1
Lastpage
6
Abstract
Low-tech hazards can cause catastrophic results in safety-critical and other systems. Designers sometimes fail to give adequate consideration to hazards in low-tech areas such as electrical interconnection designs, particularly when different design teams develop the subsystems on opposite ends of the interconnections. A good approach to addressing these hazards is a structured bent pin analysis that considers real-world conditions. This analysis can be applied to interconnection designs to adequately assess their failure modes and consequences. While much of the analysis can be automated to incorporate real-world conditions and produce accurate results, the human analyst must be aware that certain names or labels assigned by designers in their drawings may be misleading and present possible risks. The analyst must understand these risks when performing the analysis because they will affect its conclusions.
Keywords
design engineering; failure (mechanical); hazards; electrical interconnection designs; failure modes; interconnection design safety; low-tech hazards; safety-critical systems; structured bent pin analysis; Conductors; Integrated circuit interconnections; Manuals; Pins; Software; Wire; Bent Pin Analysis; FMEA; FMECA; Interfaces;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium (RAMS), 2011 Proceedings - Annual
Conference_Location
Lake Buena Vista, FL
ISSN
0149-144X
Print_ISBN
978-1-4244-8857-5
Type
conf
DOI
10.1109/RAMS.2011.5754432
Filename
5754432
Link To Document