0.1 CC 60% efficiency power amplifier multi-chip modules for personal digital cellular phones

Author

Saso, T. ; Hasegawa, Y. ; Saito, Y. ; Kakuta, Y.

Author_Institution

IC & Discrete Operation Unit, NEC Corp., Kawasaki, Japan

Volume

4

fYear

1999

fDate

13-19 June 1999

Firstpage

1401

Abstract

0.1 cc high efficiency two-stage power amplifier multi-chip modules (PA MCM´s) employing a novel resin multilayer printed circuit substrate and heterojunction FETs (HJFET´s) has been successfully developed for 900 MHz band personal digital cellular phones. This power MCM with only 0.1 cc volume (7.0/spl times/7.0/spl times/2.0 mm/sup 3/) exhibited a power added efficiency of 60% with an adjacent channel leakage power of -49.25 dBc at an output of 30.0 dBm.

Keywords

MMIC power amplifiers; UHF integrated circuits; UHF power amplifiers; adjacent channel interference; cellular radio; digital radio; field effect MMIC; integrated circuit packaging; multichip modules; personal communication networks; 60 percent; 900 MHz; HJFET; adjacent channel leakage power; heterojunction FETs; multi-chip modules; personal digital cellular phones; power added efficiency; power amplifier; resin multilayer printed circuit substrate; Cellular phones; Conductors; FETs; High power amplifiers; Nonhomogeneous media; Operational amplifiers; Power amplifiers; Printed circuits; Resins; Semiconductor optical amplifiers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1999 IEEE MTT-S International

Conference_Location

Anaheim, CA, USA

Print_ISBN

0-7803-5135-5

Type

conf

DOI

10.1109/MWSYM.1999.780211

Filename

780211