• DocumentCode
    3002691
  • Title

    Nanoelectronics - now or never? [Panel Discussion Topics]

  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    623
  • Abstract
    Summary form only given. Traditional ´top-down´ microelectronics has become nanoelectronics with device dimensions comparable to those being explored in the new field of ´bottom-up´ nano- and molecular electronics. We use the terms, top-down and bottom-up, in a very general sense. Top-down refers to a way of thinking and building that begins at the macro (continuum) scale and pushes to the nanoscale. Bottom-up refers to a way of thinking and building that begins at the atomistic level and builds up to the nanoscale. The top-down approach has already delivered silicon MOSFETs with channel lengths of ∼5nm, but scaling down device dimensions with commensurate increase in device and system performance is increasingly challenging. Bottom-up technology has demonstrated molecular switches, nanotube and nanowire FET´s, NDR and single electron devices, and ultra-dense memory prototypes. Is bottom-up nanotechnology ready to address the industry´s challenges, or is it still long-term research with essentially unpredictable outcomes? This panel debates the question of what the intersection of top-down and bottom-up electronics mean to semiconductor technology of the future. A panel of experts provide their perspectives and engage the audience in a debate on the likely role of unconventional nano- and molecular electronics in future electronic systems.
  • Keywords
    molecular electronics; nanoelectronics; bottom-up electronics; bottom-up nanotechnology; molecular electronics; molecular switches; nanoelectronics; nanotube FET; nanowire FET; scaled-down device dimensions; semiconductor technology; silicon MOSFET; single electron devices; top-down microelectronics; ultra-dense memory prototypes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8684-1
  • Type

    conf

  • DOI
    10.1109/IEDM.2004.1419240
  • Filename
    1419240