DocumentCode :
3003097
Title :
Advanced interconnection technologies and system-level communications functions
Author :
Hornak, L.A. ; Tewksbury, S.K. ; Weidman, T.W. ; Kwock, E.W.
Author_Institution :
AT&T Bell Labs., Holmdel, NJ, USA
fYear :
1989
fDate :
12-13 Jun 1989
Firstpage :
211
Lastpage :
225
Abstract :
Drawing on advanced packaging and interconnection schemes along with advances in VLSI technologies, the authors consider some examples of novel interconnection technologies. Novel polymer waveguides requiring only exposure to deep UV to fabricate a waveguide are emphasized as a potentially important material compatible with overlaying complex VLSI circuitry. Superconducting microstrip interconnections are considered. These examples suggest that conventional VLSI silicon technologies will evolve to become the support for the selective introduction of advanced interconnection technologies, yielding within the smaller system volumes of wafer-level systems the heterogeneous mixture of technologies seen in, or being introduced into, conventional, complex systems. It is pointed out that the specific examples used are microfabricated structures on substrates appropriate for achieving narrow features
Keywords :
VLSI; metallisation; strip lines; superconducting thin films; VLSI; VLSI technologies; WSI; advanced interconnection technologies; deep UV exposure; microfabricated structures; multilevel interconnection; narrow features; overlaying complex VLSI circuitry; polymer waveguides; superconducting microstrip; system-level communications functions; wafer-level systems; Capacitance; Communications technology; Driver circuits; Electronics packaging; Integrated circuit interconnections; Optical interconnections; Optical waveguides; Silicon; Space technology; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1989. Proceedings., Sixth International IEEE
Conference_Location :
Santa Clara, CA
Type :
conf
DOI :
10.1109/VMIC.1989.78024
Filename :
78024
Link To Document :
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