• DocumentCode
    3003277
  • Title

    Performance comparison between carbon nanotube and copper interconnects for GSI

  • Author

    Naeemi, Azad ; Sarvari, Reza ; Meindl, James D.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    699
  • Lastpage
    702
  • Abstract
    The performances of minimum-size copper and carbon nanotube interconnects are compared for various ITRS generations. Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube-bundles with larger wave speeds must be used. At the 45nm node (year 2010), the performance enhancement that can be achieved by using nanotube-bundles is negligible, and at the 22nm node (year 2016) it can be as large as 30% and 80% if carbon nanotubes with electron mean free paths of 5μm and 10μm, respectively, can be fabricated.
  • Keywords
    carbon nanotubes; copper; integrated circuit interconnections; 22 nm; 45 nm; GSI; carbon nanotube; copper interconnects; electron mean free paths; nanotube-bundles; wave propagation; Carbon nanotubes; Copper; Electrons; Inductance; Integrated circuit interconnections; Kinetic energy; Kinetic theory; Rough surfaces; Surface roughness; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
  • Print_ISBN
    0-7803-8684-1
  • Type

    conf

  • DOI
    10.1109/IEDM.2004.1419265
  • Filename
    1419265