DocumentCode
3003277
Title
Performance comparison between carbon nanotube and copper interconnects for GSI
Author
Naeemi, Azad ; Sarvari, Reza ; Meindl, James D.
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2004
fDate
13-15 Dec. 2004
Firstpage
699
Lastpage
702
Abstract
The performances of minimum-size copper and carbon nanotube interconnects are compared for various ITRS generations. Results offer important guidance regarding the nature of carbon nanotube technology development needed for improving interconnect performance. Since wave propagation is slow in a single nanotube, nanotube-bundles with larger wave speeds must be used. At the 45nm node (year 2010), the performance enhancement that can be achieved by using nanotube-bundles is negligible, and at the 22nm node (year 2016) it can be as large as 30% and 80% if carbon nanotubes with electron mean free paths of 5μm and 10μm, respectively, can be fabricated.
Keywords
carbon nanotubes; copper; integrated circuit interconnections; 22 nm; 45 nm; GSI; carbon nanotube; copper interconnects; electron mean free paths; nanotube-bundles; wave propagation; Carbon nanotubes; Copper; Electrons; Inductance; Integrated circuit interconnections; Kinetic energy; Kinetic theory; Rough surfaces; Surface roughness; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
Print_ISBN
0-7803-8684-1
Type
conf
DOI
10.1109/IEDM.2004.1419265
Filename
1419265
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