• DocumentCode
    3003791
  • Title

    High performance and high reliability polysilicon thin-film transistors with multiple nano-wire channels

  • Author

    Wu, Yung-Chun ; Chang, Chun-Yen ; Chang, Ting-Chang ; Liu, Po-Tsun ; Chen, Chi-Shen ; Tu, Chun-Hao ; Zan, Hsiao-Wen ; Tai, Ya-Hsiang ; Sze, Simon Min

  • Author_Institution
    Inst. of Electron., National ChiaoTung Univ., Hsinchu, Taiwan
  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    777
  • Lastpage
    780
  • Abstract
    We have investigated the lightly-doped drain (LDD) polysilicon thin-film transistors (poly-Si TFTs) with a series of multi-channel with different widths. The ten 67 nm-wide split channels TFT has best gate control due to its tri-gate structure, and has lowest poly-Si grain boundary defects, which were passivated by NH3 plasma effectively due to its split nano-wires structure. The proposed TFT exhibits high performance electrical characteristics, such as a high ON/OFF current ratio (> 109), a steep subthreshold slope (55) of 137 mV/decade, an absence of drain-induced barrier lowering (DIBL), suppressed kink-effect, and superior reliability.
  • Keywords
    elemental semiconductors; grain boundaries; nanowires; semiconductor device manufacture; semiconductor device reliability; silicon; thin film transistors; 67 nm; ON/OFF current ratio; Si; drain-induced barrier lowering; gate control; high performance electrical characteristics; kink-effect supression; lightly-doped drain poly-Si TFT; multiple nanowire channels; plasma passivation; poly-Si grain boundary defects; polysilicon thin-film transistors; split channels TFT; split nanowires structure; subthreshold slope; tri-gate structure; CMOS technology; Electric variables; Electrodes; Etching; Leakage current; MOSFET circuits; Physics; Strips; Thin film transistors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
  • Print_ISBN
    0-7803-8684-1
  • Type

    conf

  • DOI
    10.1109/IEDM.2004.1419289
  • Filename
    1419289