DocumentCode
3003843
Title
Review of 3D Technology for Semiconductor Optoelectronics
Author
Zhang, Sam
Author_Institution
R&D Team Leader, High Performance Sensors Excelitas Technol. Inc., Vaudreuil, QC, Canada
fYear
2012
fDate
21-23 May 2012
Firstpage
1
Lastpage
3
Abstract
The 3D integration and packaging of semiconductor devices has gone through a paradigm shift over the last decade. The 3D technology outperforms conventional semiconductor assembling methods in density, cost, and performance simultaneously. This paper summarizes characteristics,platforms, approaches, and trends in 3D semiconductor optoelectronics.
Keywords
integrated optoelectronics; reviews; semiconductor device packaging; 3D integration; 3D technology; packaging; semiconductor devices; semiconductor optoelectronics; Arrays; Electronics industry; Packaging; Performance evaluation; Semiconductor devices; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Photonics and Optoelectronics (SOPO), 2012 Symposium on
Conference_Location
Shanghai
ISSN
2156-8464
Print_ISBN
978-1-4577-0909-8
Type
conf
DOI
10.1109/SOPO.2012.6270984
Filename
6270984
Link To Document