• DocumentCode
    3003898
  • Title

    Soft error trends and mitigation techniques in memory devices

  • Author

    Slayman, Charles

  • Author_Institution
    Ops A La Carte, Santa Clara, CA, USA
  • fYear
    2011
  • fDate
    24-27 Jan. 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    As CMOS process technology scales below 100nm, the amount of charge required to upset a gate or memory cell (Qcrit) is decreasing. Therefore, the probability that an energetic particle can generate enough charge to upset a circuit is increasing. Since these single event upsets do not damage the IC, they are called soft errors. With the proper detection and correction schemes, these particle induced soft errors can be mitigated in a way that does not impact the overall reliability of an electronic system. Since memory devices such as SRAM, DRAM and Flash comprise the largest gate counts in many designs, it is essential to understand their soft error mechanisms, characterize their soft error rates and develop effective mitigation techniques.
  • Keywords
    CMOS memory circuits; DRAM chips; SRAM chips; flash memories; CMOS process technology; DRAM; Flash; SRAM; energetic particle; memory devices; mitigation techniques; soft error mechanisms; soft error trends; Computer architecture; Error analysis; Error correction codes; Neutrons; Physics; Random access memory; Reliability; Alpha particle; cosmic ray; single event upset; soft error; terrestrial neutron;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium (RAMS), 2011 Proceedings - Annual
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0149-144X
  • Print_ISBN
    978-1-4244-8857-5
  • Type

    conf

  • DOI
    10.1109/RAMS.2011.5754515
  • Filename
    5754515