DocumentCode
3003898
Title
Soft error trends and mitigation techniques in memory devices
Author
Slayman, Charles
Author_Institution
Ops A La Carte, Santa Clara, CA, USA
fYear
2011
fDate
24-27 Jan. 2011
Firstpage
1
Lastpage
5
Abstract
As CMOS process technology scales below 100nm, the amount of charge required to upset a gate or memory cell (Qcrit) is decreasing. Therefore, the probability that an energetic particle can generate enough charge to upset a circuit is increasing. Since these single event upsets do not damage the IC, they are called soft errors. With the proper detection and correction schemes, these particle induced soft errors can be mitigated in a way that does not impact the overall reliability of an electronic system. Since memory devices such as SRAM, DRAM and Flash comprise the largest gate counts in many designs, it is essential to understand their soft error mechanisms, characterize their soft error rates and develop effective mitigation techniques.
Keywords
CMOS memory circuits; DRAM chips; SRAM chips; flash memories; CMOS process technology; DRAM; Flash; SRAM; energetic particle; memory devices; mitigation techniques; soft error mechanisms; soft error trends; Computer architecture; Error analysis; Error correction codes; Neutrons; Physics; Random access memory; Reliability; Alpha particle; cosmic ray; single event upset; soft error; terrestrial neutron;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium (RAMS), 2011 Proceedings - Annual
Conference_Location
Lake Buena Vista, FL
ISSN
0149-144X
Print_ISBN
978-1-4244-8857-5
Type
conf
DOI
10.1109/RAMS.2011.5754515
Filename
5754515
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