DocumentCode :
3004150
Title :
A self-aligned vertical Kelvin test structure to measure contact resistivities of Al and Ti on Si
Author :
Yang, Wen Luh ; Lei, Tan Fu ; Lee, Chung Len
Author_Institution :
Inst. of Electron, Nat. Chiao Tung Univ., Hsin Chu, Taiwan
fYear :
1989
fDate :
12-13 Jun 1989
Firstpage :
267
Lastpage :
273
Abstract :
A self-aligned vertical Kelvin test resistor structure, which not only eliminates the horizontal current crowding but also avoids the misalignment error, is proposed and used to measure pc of Al and Ti on Si. For the Al(1%Si)/n+-Si contact system, a specific contact resistivity of 1×10-7 Ω-cm2 has been measured. For the TiSi2 contacts, the TiSi2(direct-reaction)/n+-Si contact offers a lower pc than that of the coevaporated TiSi 2/n+-Si contact, and pc does not change even after the contacts are annealed to 900°C
Keywords :
VLSI; aluminium; annealing; electric resistance measurement; elemental semiconductors; metallisation; ohmic contacts; semiconductor-metal boundaries; silicon; titanium compounds; 900 C; AlSi-Si contact; TiSi2-Si contact; TiSi2/n+-Si contact; VLSI; annealing; contact resistivities measurement; horizontal current crowding elimination; misalignment error avoidance multilevel interconnection; modelling; self-aligned vertical Kelvin test resistor structure; specific contact resistivity; test structure; Amorphous materials; Annealing; Automatic testing; Conductivity; Fabrication; Kelvin; Metallization; Protection; Resists; Semiconductor films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1989. Proceedings., Sixth International IEEE
Conference_Location :
Santa Clara, CA
Type :
conf
DOI :
10.1109/VMIC.1989.78030
Filename :
78030
Link To Document :
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